STM News 2017 Q3 & Q4


  • News and Updates from STMicroelectronics – July 2017

    • Standalone USB Type-C™ Power Delivery controller – high voltage, safe, robust
      The new STUSB4710 integrates all the digital and high-voltage analog circuitry needed to autonomously support full USB PD negotiation with up to 5 Power Data Objects (PDO).
      Increased flexibility is provided by an optional I²C interface to address multi-ports and power-sharing applications.
      This full hardware solution targets power-source applications such AC adapters, power supplies, power hubs, smart plugs and DC-DC applications.
    • New STM32 Nucleo pack for USB Type-C™ and Power Delivery

      Based on two STUSB1602 USB Type-C™ port controllers and an STM32F0 Cortex®-M0 MCU, the full-featured P-NUCLEO-USB002 development kit enables fast prototyping of USB PD applications leveraging a comprehensive set of ready-to-use ST components and software packages including the X-CUBE-USB-PD Power delivery stack.
      This dual-port solution is fully configurable and ready to support different power roles like provider, consumer or DRP
    • Maximize battery life and lifespan with advanced charger management IC
      The STBC02 battery-charger management chip improves integration without compromising performance and power consumption.
      It combines a linear battery charger, a 150 mA LDO, two SPDT switches, a smart reset/watchdog, automatic power path management and a battery protection circuit.
      The STBC02 improves battery life and offers the perfect solution for wearable and IoT markets, reducing application cost, footprint and design time.
    • MDmesh DK5 series with high power density for more compact solutions
      New 950-1050 V super-junction MOSFETs with fast recovery diode offer industry-best reverse recovery time of 250 ns (typ.), combined with industry’s lowest RDS(on) (0.12 Ω in Max247 and ISOTOP packages) and very low gate charge (45 nC) helps maximize the system efficiency and increase power density.
      Available in through-hole and SMD power packages including long-lead TO-247 and ISOTOP packages
    • EEPROM in DFN5 package combines small footprint and handling robustness
      ST’s I²C EEPROMs in DFN5 package fit applications where space constraints and manufacturing robustness are key factors.
      Headsets, Wi-Fi and Bluetooth modules, wearables and even drones will find great benefit in switching from DFN8 to DFN5 packages thanks to reduced pin count, significantly smaller footprint and 50% lighter weight.
      Molded package allows manufacturing on mature lines helping optimize production costs for size competitive modules
    • Popular blog posts


  • STM32 ODE v.2 news from STMicroelectronics – June 2017

To help developers create more advanced IoT applications, Open.Audio (audio processing), Open.MEMS (motion recognition algorithm) and Open.RF (communication protocols) libraries from our Open Software Expansion development suite are now being integrated into the STM32 ODE offer.

Check out how our upgraded STM32 ODE Function Packs help you build an IoT sensor node

STM32 ODE Function Packs are pre-assembled middleware libraries with real-life application examples to help you build your prototype in minutes using a suitable combination of STM32 Nucleo development and X-Nucleo expansion boards.

We have now upgraded our Function Packs dedicated to building IoT sensor nodes with new advanced libraries to help you create more feature-rich designs:

FP-SNS-MOTENV1 for accessing environmental and motion sensor data, is now enhanced with sensor data fusion and accelerometer-based real-time activity recognition capabilities.

FP-SNS-ALLMEMS1 providing access to environmental, motion sensors and digital microphones data, now provides sensor data fusion and accelerometer-based real-time activity recognition, as well as acoustic source localization capabilities and voice-over-BLE communication profiles.

FP-SNS-FLIGHT1 for environmental, motion and time-of-flight ranging sensors data access and BLE pairing via NFC, is now enhanced with sensor data fusion and accelerometer-based real-time activity recognition capabilities.

X-Cube expansion software package for STM32 now enhanced with pre-integrated motion, RF and audio libraries

X-Cube expansion software packages are a basic set of software components like HAL, LL APIs, middleware and application examples designed to help users explore the capabilities of the STM32 used together with a range of sensing, power management, connectivity or audio ICs and MEMS.

We have now upgraded some of our X-Cube expansion software packages with advanced motion, RF and audio libraries:

X-CUBE-SUBG1, associated to the X-NUCLEO-IDS01A4 and X-NUCLEO-IDS01A5 STM32 Nucleo Sub-1 GHz RF expansion board, includes now a Contiki OS/6LoWPAN middleware.

X-CUBE-BLE1, associated to the X-NUCLEO-IDB04A1 and X-NUCLEO-IDB05A1 STM32 Nucleo BLE expansion board, now provides Bluetooth Low Energy profiles.

X-CUBE-MEMSMIC1, associated to the X-NUCLEO-CCA02M1 STM32 Nucleo Digital MEMS microphone expansion board, now supports real-time beamforming and sound source localization.

X-CUBE-MEMS1, associated to the X-NUCLEO-IKS01A1 and X-NUCLEO-IKS01A2 STM32 Nucleo motion MEMS and environmental sensor expansion board, is enhanced with 13 libraries for improved handling of motion sensor data.


  • STM32 ODE v.1 news from STMicroelectronics – June 2017

    • To help developers create more advanced IoT applications, Open.Audio (audio processing), Open.MEMS (motion recognition algorithm) and Open.RF (communication protocols) libraries from our Open Software Expansion development suite are now being integrated into the STM32 ODE offer.Check out how our upgraded STM32 ODE Function Packs help you build an IoT sensor nodeSTM32 ODE Function Packs are pre-assembled middleware libraries with real-life application examples to help you build your prototype in minutes using a suitable combination of STM32 Nucleo development and X-Nucleo expansion boards.We have now upgraded our Function Packs dedicated to building IoT sensor nodes with new advanced libraries to help you create more feature-rich designs:

      • FP-SNS-MOTENV1 for accessing environmental and motion sensor data, is now enhanced with sensor data fusion and accelerometer-based real-time activity recognition capabilities.
      • FP-SNS-ALLMEMS1 providing access to environmental, motion sensors and digital microphones data, now provides sensor data fusion and accelerometer-based real-time activity recognition, as well as acoustic source localization capabilities and voice-over-BLE communication profiles.
      • FP-SNS-FLIGHT1 for environmental, motion and time-of-flight ranging sensors data access and BLE pairing via NFC, is now enhanced with sensor data fusion and accelerometer-based real-time activity recognition capabilities.

      X-Cube expansion software package for STM32 now enhanced with pre-integrated motion, RF and audio libraries

      X-Cube expansion software packages are a basic set of software components like HAL, LL APIs, middleware and application examples designed to help users explore the capabilities of the STM32 used together with a range of sensing, power management, connectivity or audio ICs and MEMS.

      We have now upgraded some of our X-Cube expansion software packages with advanced motion, RF and audio libraries:

      • X-CUBE-SUBG1, associated to the X-NUCLEO-IDS01A4 and X-NUCLEO-IDS01A5 STM32 Nucleo Sub-1 GHz RF expansion board, includes now a Contiki OS/6LoWPAN middleware.
      • X-CUBE-BLE1, associated to the X-NUCLEO-IDB04A1 and X-NUCLEO-IDB05A1 STM32 Nucleo BLE expansion board, now provides Bluetooth Low Energy profiles.
      • X-CUBE-MEMSMIC1, associated to the X-NUCLEO-CCA02M1 STM32 Nucleo Digital MEMS microphone expansion board, now supports real-time beamforming and sound source localization.
      • X-CUBE-MEMS1, associated to the X-NUCLEO-IKS01A1 and X-NUCLEO-IKS01A2 STM32 Nucleo motion MEMS and environmental sensor expansion board, is enhanced with 13 libraries for improved handling of motion sensor data.

  • Smart Driving news from STMicroelectronics – June 2017

    • Enter and start cars with a NFC phone using AEC-Q100 Grade 1 qualified reader ICs
      The ST25R3914/15 are AEC-Q100 Grade 1 qualified reader front-ends that are specifically designed for the demanding automotive environment.
      Combining automatic antenna tuning with guaranteed 1W output power, these reader ICs achieve the highest operating ranges with the smallest antenna sizes and work seamlessly together with wireless charging technologies like Qi.
      Adding excellent P2P capabilities, they enhance the overall user experience when accessing a car with any NFC-enabled device.
    • Meet the next generation of door zone controller ICs
      Tailored for rear door systems, the L99DZ120 provides electronic control modules with enhanced power management, including various standby modes, as well as a LIN physical communication layer.
      In addition to 2 LDOs, 8 high-side drivers to supply LEDs and 2 high-side drivers to supply bulbs increase the system integration level and can drive up to 3 DC motors and 4 external MOS transistors in an H-bridge configuration. Its SPI for device control and diagnostics also enables generic software development.
    • 40 V automotive MOSFETs in tiny 5×6 mm dual-side cooling package shrink ECUs
      ST now offers low-voltage AEC-Q101 qualified MOSFETs housed in the new PowerFLAT™ 5 x 6 mm dual-side cooling package with wettable flanks that exposes the top-side source electrode to further enhance heat dissipation, retaining the footprint and thermally efficient bottom-side design of the standard package.
      Able to support a higher current rating that increases power density, the STLD200N4F6AG and STLD125N4F6AG let designers build smaller ECUs without trading off functionality, performance, or reliability.
    • 39V low capacitance dual-line ESD protection for 24V systems in trucks
      ST’s ESDCAN0x-2BWY series is AEC-Q101 qualified and designed to protect automotive communication buses especially in trucks where its 39 V VBR allows a safe implementation.
      Its line capacitance (< 3.5 pF) combined with its high robustness (> 25 kV ISO 10605) simplifies the design and reduces time-to-market. The capacitance matching between lines does not exceed a best-in-class 0.1pF for skew reduction and compliance with fastest interfaces.
      Now available in the SOT323-3L package for PCB saving
    • Optimize configurations with SPI-controlled octal channel driver
      The L9301 is a SPI-controlled multiple channel switch with 4 high/low and 8 low-side drivers with the possibility of using four of them as integrated recirculation diodes for PWM load driving.
      Several configurations can be achieved with the possibility to parallelize two outputs for higher current capability.
      Use the Serial Peripheral Interface to configure device parameters, send driver commands and read back diagnostics. It comes with an evaluation board and dedicated GUI.
    • Evaluate the flexibility of the L5963 multichannel voltage regulator
      EVAL-L5963 and EVAL-L5963Q evaluation boards let you assess the performance of the L5963 multichannel automotive voltage regulator in both PSSO36 and QFN48 packages respectively.
      Battery-compatible and able to deliver up to 3 A from each of the two embedded dc-dc regulators and up to 250 mA from the linear regulator, the L5963 simplifies power up/down sequencing and is perfect for double USB hubs, clusters, infotainment and car electronics in general.
    • 1200V, 30A & 60A standard diodes for safer automotive input bridge circuits
      Providing low forward voltage drop and high surge capabilities, the new 1200 V STBR3012WY (30 A) and STBR6012WY (60 A) diodes – housed in the high-power DO-247 package – provide superior surge performance.
      They make safer AC/DC converters by limiting inrush current for mixed input bridges when combined with TN3050H-12WY and TN5050H-12WY thyristors in a through-hole TO-247 package or the TN3050H-12GY in a D²PAK.
    • A significantly lower switching loss with automotive-grade 1200 V SiC diodes
      The ultimate combination of a very low forward voltage drop (VF ), a high-surge non-repetitive forward current (IFSM ) and a low total capacitive charge (Qc) contributes to downsize the overall board area in automotive applications where high-speed switching operations with the highest efficiency are required.
      Housed in D²PAK and TO-220AC packages, the STPSC10H12-Y, STPSC15H12-Y and STPSC20H12-Y fulfill automotive robustness and performance requirements.
    • Recent blog posts