STM32WB series – 2.4 Ghz Wireless MCUs

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STM32WBDual-Core with Cortex-M and interface for Bluetooth 5, ZigBee, MiWi and more.

STMicroelectronics Powers Next-Generation IoT Devices with Higher-Performing Multiprotocol Bluetooth® & 802.15.4 (ZigBee, MiWi, …) System-on-Chip

STM32WB, its first dual Arm® Cortex®-M-core MCUs (M4 & M0+) with embedded transceiver at 2,4 GHz.
Arm Cortex-M0+ core drive a 2.4-GHz multi-protocol radio that supports Bluetooth 5.0, Thread, and proprietary IEEE 802.15.4 in a concurrent mode; the M0+ core also handles security and protection.

The STM32WB dual-core MCUs with wireless support (at 2,4MHz – BLE) are based on an Arm® Cortex®‐M4 core running at 64 MHz (application processor) and an Arm® Cortex®‐M0+ core at 32 MHz (network processor).
With two totally independent cores, this innovative architecture is optimized for real‑time execution (radio‑related software processing), resource use flexibility, power management, and BOM cost, to bring better user experience.

The STM32WB55 Bluetooth 5 -certified device offers Mesh 1.0 software support, multiple profiles and flexibility to integrate proprietary BLE stacks.

OpenThread-certified software stack is available.
The radio can also run BLE/OpenThread protocols concurrently.
The embedded generic MAC allows the usage of other IEEE 802.15.4 proprietary stacks like ZigBee®, or proprietary protocols, giving even more options for connecting devices to the Internet of Things (IoT).

Key Features of the STM32WB55VG

  • Includes ST state-of-the-art patented technology
  • Radio
    • 2.4 GHz RF transceiver supporting Bluetooth® specification v5.0 and IEEE 802.15.4-2011 PHY and MAC
    • RX Sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
    • Programmable output power up to +6 dBm with 1 dB steps
    • Integrated balun to reduce BOM
    • Support for 2 Mbps
    • Dedicated Arm® 32-bit Cortex® M0+ CPU for real-time Radio layer
    • Accurate RSSI to enable power control
    • Compliant with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
  • Ultra-low-power platform
    • 1.71 V to 3.6 V power supply
    • – 40 °C to 85 / 105 °C temperature ranges
    • 30 nA shutdown mode
    • 600 nA Standby mode + RTC + 32 KB RAM
    • 1.8 μA Stop mode + RTC + 256 KB RAM
    • Active-mode MCU + RF (SMPS ON): < 50 μA/MHz
    • RX: 3.8 mA
    • TX at 0 dBm: 5.5 mA
  • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
  • Supply and Reset management
    • High efficiency embedded SMPS step-down converter
    • Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
    • Ultra-low-power POR/PDR
    • Programmable voltage detector (PVD)
    • VBAT mode with RTC and backup registers
  • Clock sources
    • 32 MHz crystal oscillator with integrated trimming capacitors (Radio and CPU clock)
    • 32 kHz crystal oscillator for RTC (LSE)
    • Internal low-power 32 kHz (±5%) RC (LSI1)
    • Internal low-power 32 kHz (stability ±500 ppm) RC (LSI2)
    • Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy)
    • High Speed internal 16 MHz factory trimmed RC (±1%)
    • 2x PLL for system clock, USB, SAI and ADC
  • Memories
    • Up to 1 MB Flash with sector protection (PCROP) against R/W operations, enabling authentic Bluetooth® Low Energy and 802.15.4 SW stack
    • Up to 256 KB RAM, including 64 KB with hardware parity check
      20×32-bit Backup Register
    • Boot loader supporting, USART, SPI, I2C and USB interfaces
    • OTA (Over the Air) Bluetooth® Low Energy and 802.15.4 update
    • Quad SPI memory interface with XIP
  • Rich Analog peripherals (down to 1.62 V)
    • 12-bit ADC 4.26Msps, up to 16-bit with hardware oversampling, 200 μA/Msps
    • 2x ultra-low-power comparator
    • Accurate 2.5 V or 2.048 V reference voltage buffered output
    • System peripherals
    • Inter Processor Communication Controller (IPCC) for communication with
    • Bluetooth® Low Energy and 802.15.4
    • HW semaphores for resources sharing between CPUs
    • 2x DMA controllers (7x channels each) supporting ADC, SPI, I2C, USART, QSPI,
    • SAI, AES, Timers
    • 1x USART (ISO 7816, IrDA, SPI Master, Modbus and Smartcard mode)
    • 1x LPUART (Low Power)
    • 2x SPI 32 Mbit/s
    • 2x I2C (SMBus/PMBus)
    • 1x SAI (dual channels)
    • 1x USB 2.0 FS device, crystal-less, BCD and LPM
    • Touch Sensing controller, up to 28 channels
    • LCD 8×40 with step-up converter
    • 1x 16-bit, four channels advanced timer
    • 2x 16-bits, two channels timer
    • 1x 32-bits, four channels timer
    • 2x 16-bits ultra-low-power timer
    • 1x independent Systick
    • 1x independent watchdog
    • 1x window watchdog
  • Security & ID
    • Secure Firmware Installation (SFI) for Bluetooth® Low Energy and 802.15.4 SW stack
    • Hardware Encryption AES 256-bit
    • Customer key storage / key manager services
    • HW Public Key Authority (PKA)
    • Cryptographic algorithms: RSA, Diffie-Helman, ECC over GF(p)
    • True random number generator (TRNG)
    • Sector protection against R/W operation (PCROP)
    • CRC calculation unit
    • 96-bit unique ID
    • 64-bit unique ID. Possibility to derive 802.15.5 64-bit and Bluetooth® Low Energy 48-bit EUI
  • Up to 72 fast I/Os, 70 of them 5 V-tolerant
  • Development support
    • Serial wire debug (SWD), JTAG for the Application processor
    • Application cross trigger with input and output
    • Embedded Trace Macrocell™ for application
  • All packages are ECOPACK2® compliant

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PDF presentation

Here there is a STM32WB presentation (2018 v.1.0).

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MKT presentation

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Evaluation kits is: P-NUCLEO-WB55

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